Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB
(2021) 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) — Location: Online (13.September.2021)
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5068254-Stoukatch_S_Ultra-thinned_SOI_ACF_FC_EMPC2021.pdf
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Stoukatch, S., André, N., Dupont, F., Redouté, J.-M., & Flandre, D. (2021). Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB. Proceedings, p. 1-5. https://doi.org/10.23919/EMPC53418.2021.9584947