Parametric Modeling for Improved Die Area Estimation in the Life Cycle Assessment of Electronic Systems
(2024) Electronics Goes Green 2024+ — Location: Berlin (18.June.2024)
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Wattiez, A., Dethienne, R., Collin, A.-S., & Bol, D. (2024). Parametric Modeling for Improved Die Area Estimation in the Life Cycle Assessment of Electronic Systems. Electronics Goes Green 2024+, Berlin. https://hdl.handle.net/2078.5/256537