Bottom-Up Life-Cycle Assessment of MEMS Piezoresistive Pressure Sensors
(2021) 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) — Location: Paris, France (25.August.2021)
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Bottom-Up_Life-Cycle_Assessment_of_MEMS_Piezoresistive_Pressure_Sensors.pdf
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Delhaye, T. P., Le Brun, G., Flandre, D., & Raskin, J.-P. (2021). Bottom-Up Life-Cycle Assessment of MEMS Piezoresistive Pressure Sensors. Proceedings, p. 1-6. https://doi.org/10.1109/dtip54218.2021.9568683