Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon

Mulay, Shantanu S.;Becker, Gauthier;Vayrette, Renaud;Raskin, Jean-Pierre;Noels, Ludovic;et.al.
(2015) Computational Mechanics : solids, fluids, engineered materials, aging, infrastructure, molecular dynamics, heat transfer, manufacturing processes, optimization, fracture and integrity — Vol. 55, n° 1, p. 73-91 (2015)

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Authors
  • Mulay, Shantanu S.Dpt Aerospace and Mechanical Engineering, ULg, Belgium
    Author
  • Becker, GauthierDpt Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, USA
    Author
  • Vayrette, RenaudUCLouvain
    Author
  • Raskin, Jean-PierreUCLouvain
    Author
  • Pardoen, ThomasUCLouvain
    Author
  • Noels, LudovicDpt Aerospace and Mechanical Engineering, ULg, Belgium
    Author
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Abstract
Micro-electro-mechanical systems (MEMS) made of polycrystalline silicon are widely used in several engineering fields. The fracture properties of polycrystalline silicon directly affect their reliability. The effect of the orientation of grains on the fracture behaviour of polycrystalline silicon is investigated out of the several factors. This is achieved, firstly, by identifying the statistical variation of the fracture strength and critical strain energy release rate, at the nanoscopic scale, over a thin freestanding polycrystalline silicon film having mesoscopic scale dimensions. The fracture stress and strain at the mesoscopic level are found to be closely matching with uniaxial tension experimental results. Secondly, the polycrystalline silicon film is considered at the continuumMEMSscale, and its fracture behaviour is studied by incorporating the nanoscopic scale effect of grain orientation. The entire modelling and simulation of the thin film is achieved by combining the discontinuous Galerkin method and extrinsic cohesive law describing the fracture process.
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Mulay, S. S., Becker, G., Vayrette, R., Raskin, J.-P., Pardoen, T., Galceran, M., Godet, S., & Noels, L. (2015). Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon. Computational Mechanics : solids, fluids, engineered materials, aging, infrastructure, molecular dynamics, heat transfer, manufacturing processes, optimization, fracture and integrity, 55(1), 73-91. https://doi.org/10.1007/s00466-014-1083-4 (Original work published 2015)