3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring

Anton Köck;Bol, David;Flandre, Denis;et.al.
(2019) IEEE TRANSDUCERS & Eurosensors XXXIII

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his paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors – this is a worldwide unique sensor system.
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Anton Köck, Bol, D., Flandre, D., & et al. (2019). 3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring. IEEE Solid-State Sensor and Actuator Workshop. Technical Digest, 2019, 1136-1139. https://hdl.handle.net/2078.5/170028 (Original work published 2019)