Heat sink implementation in back-end of line for self-heating reduction in 22 nm FDSOI MOSFETs
(2021) Solid-State Electronics — Vol. 184, p. 108088 (2021)
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- Authors
Halder, Arka 
Nyssens, Lucas
- Abstract
- This work studies the effect of heat sink in the back-end of line (BEOL) on the self-heating (SH) parameters of transistors in a Fully Depleted Silicon-on-Insulator (FDSOI) technology. The RF characterization technique, which involves S-parameter measurements over a wide frequency range, is used to evaluate SH parameters. Two types of sink configurations in the BEOL are considered; one connected to the gate and the other left floating. We experimentally demonstrate that gate-connected heat sink allows for a reduced self-heating in 22 nm FDSOI devices. Around 15% to 30% reduction in thermal resistance is observed for the gate-connected heat sink in comparison to the floating sink
- Affiliations
Citations
Halder, A., Nyssens, L., Rack, M., Lederer, D., Raskin, J.-P., & Kilchytska, V. (2021). Heat sink implementation in back-end of line for self-heating reduction in 22 nm FDSOI MOSFETs. Solid-State Electronics, 184, 108088. https://doi.org/10.1016/j.sse.2021.108088 (Original work published 2021)