Fast and accurate modelling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements

Rack, M., Ben Ali, K., Raskin, J.-P., Sun, X., Roda Neve, C., Van der Plas, G., & Stucchi, M. (2016). Fast and accurate modelling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements. The 66th IEEE Electronic Components and Technology Conference – ECTC’16, Las Vegas, Nevada (USA). https://hdl.handle.net/2078.5/228088