C-V Measurement and Modeling of Double-BOX Trap-Rich SOI SubstrateHuang, Yang;Yan, Yiyi;Nabet, Massinissa;Liu, Fanyu;Raskin, Jean-Pierre;et.al.(2023) 9th Joint Intl EuroSOI Workshop and International Conf On Ultimate Integration on Silicon 2023 — Location: Tarragona, Spain (10.May.2023)
Filesabstract-eurosoi-2023-hy-v4.pdf Open Access Adobe PDF335.33 KBDownloadDetailsAuthorsHuang, YangUCLouvainAuthorYan, YiyiUCLouvainAuthorNabet, MassinissaUCLouvainAuthorLiu, FanyuAuthorRaskin, Jean-PierreUCLouvainAuthorShow more AffiliationsUCLouvainSST/ICTM/ELEN - Pôle en ingénierie électriqueShow moreCitations APA Chicago FWB Huang, Y., Yan, Y., Nabet, M., Liu, F., Li, B., Li, B., Han, Z., Nguyen, B.-Y., Cristoloveanu, S., & Raskin, J.-P. (2023). C-V Measurement and Modeling of Double-BOX Trap-Rich SOI Substrate. 9th Joint Intl EuroSOI Workshop and International Conf On Ultimate Integration on Silicon 2023. Published. 9th Joint Intl EuroSOI Workshop and International Conf On Ultimate Integration on Silicon 2023, Tarragona, Spain. https://hdl.handle.net/2078.5/237344