A spectral scheme for the simulation of dynamic mode 3 delamination of thin films
(2005) Engineering Fracture Mechanics — Vol. 72, n° 12, p. 1866-1891 (2005)
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- Abstract
- Motivated by recent developments in laser-induced spallation testing of thin film structures, we develop a spectral scheme for the simulation of dynamic failure of thin films. In this first study, we focus on the anti-plane shear (mode 3) loading case. The scheme relies on an exact spectral representation of the elastodynamic solutions in the substrate and in the film, and their combination through interface conditions that involve general cohesive failure and/or frictional contact models. A detailed modal analysis of the response of a single spectral mode is performed to assess the stability and precision of the resulting numerical scheme. A set of dynamic fracture problems involving non-propagating and propagating cracks are simulated to show the ability of the numerical scheme to capture the effect of wave reflection on the near-tip stress and displacement fields, and on the dynamic motion of a crack along the film/substrate interface. (c) 2005 Elsevier Ltd. All rights reserved.
- Affiliations
University of Illinois at Urbana-Champaign Aerospace Engineering Department University of Illinois at Urbana-Champaign Department of Materials Science and Engineering
Citations
Hendrickx, J., Philippe, G., & Sottos, N. (2005). A spectral scheme for the simulation of dynamic mode 3 delamination of thin films. Engineering Fracture Mechanics, 72(12), 1866-1891. https://doi.org/10.1016/j.engfracmech.2004.10.014 (Original work published 2005)