CMOS compatible 3-D self assembled microstructures using thin film SOI technology
(2004) Proceedings of the IEEE Sensors 2004 — Location: Vienna, Austria (24.October.2004)
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- Abstract
- 3D self-assembled microstructures are processed based on thin film SOI wafers. Self assembled structures going from meander inductors to flow sensors are obtained from using only one photolithographic step. The assembly of our microstructures relies on the thermal expansion mismatch between the material layers as well as control of the plastic flow of one of the layers.
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Citations
Iker, F., Si Moussa, M., André, N., Pardoen, T., & Raskin, J.-P. (2004). CMOS compatible 3-D self assembled microstructures using thin film SOI technology. In Rocha, D.; Sarro, P.M.; Vellekoop, M.J.; (ed.), Proceedings of the IEEE Sensors 2004 (IEEE Cat. No.04CH37603) (p. Vol. 3, p. 1113-16). IEEE. https://hdl.handle.net/2078.5/272242