Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB

Stoukatch, Serguei;André, Nicolas;Delhaye, Thibault;Dupont, François;Flandre, Denis;et.al.
(2020) IEEE Sensors — Vol. 2020, p. 1-4 (2020)

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Authors
  • Stoukatch, SergueiMicrosys lab, Department of Electrical Engineering and Computer Science, Liege University, Seraing, Belgium
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  • André, Nicolasorcid-logoUCLouvain
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  • Delhaye, ThibaultUCLouvain
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  • Dupont, FrançoisMicrosys lab, Department of Electrical Engineering and Computer Science, Liege University, Seraing, Belgium
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  • Flandre, Denisorcid-logoUCLouvain
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Abstract
We developed a low-cost process for assembling versatile sensors without expensive, thick metal finish on rigid and flexible PCB using anisotropic conductive films (ACF) flipchip (FC) process. This allows a lower temperature budget than conventional FC assembly. The ACF FC process requires no expensive set up, is quick to implement and suits perfectly for sensor prototyping and low-scale manufacturing. The process was directly applied to assemble the bare die of a CMOS strain gauge sensor on flexible PCB without compromising its integrity.
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Stoukatch, S., André, N., Delhaye, T., Dupont, F., Redouté, J.-M., & Flandre, D. (2020). Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. IEEE Sensors, 2020, 1-4. https://doi.org/10.1109/SENSORS47125.2020.9278669 (Original work published 2020)