On the Use of DICOM as a Storage Layer for IIIF
(2023) DaSCHCon on IIIF, 3D & Interoperability — Location: Basel, Switzerland (25.October.2023)
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Jodogne, S. (2023). On the Use of DICOM as a Storage Layer for IIIF. DaSCHCon on IIIF, 3D & Interoperability, Basel, Switzerland. https://hdl.handle.net/2078.5/270617