Mutual Inductance Evaluation Between Two Parallel Conductors on a PCB
(2023) 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS) — Location: Istanbul, Turkey (4.December.2023)
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- Abstract
- In this paper, we present a comprehensive analysis of two parallel conductors, fabricated on a printed circuit board (PCB), forming an elementary planar transformer, with an emphasis on extracting performance parameters such as self-inductance, resistance, coupling coefficient, mutual inductance, and inter-winding capacitance. Results issued from theoretical equations, FEM-based simulations, and characterizations were compared together to evaluate the mutual inductance. A procedure using the Open-Short de-embedding technique has been successfully applied to extract the correct performance values.
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Citations
Chouaibi, S., Said, M. H., Nasr, D., Ayed, M. B., Flandre, D., & Tounsi, F. (2023). Mutual Inductance Evaluation Between Two Parallel Conductors on a PCB. 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS). Published. 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Istanbul, Turkey. https://doi.org/10.1109/ICECS58634.2023.10382803