Impact of radiations on the electromechanical properties of materials and on the piezoresistive and capacitive transduction mechanisms used in microsystems

Francis, Laurent;Gkotsis, Petros;Kilchytska, Valeriya;Tang, Xiaohui;Flandre, Denis;et.al.
(2013) Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII (SPIE 2013) — Location: San Francisco (USA) (9.March.2013)

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Abstract
The impact of different types of radiation on the electromechanical properties of materials used in microfabrication and on the capacitive and piezoresistive transduction mechanisms of MEMS is investigated. MEMS technologies could revolutionize avionics, satellite and space applications provided that the stress conditions which can compromise the reliability of microsystems in these environments are well understood. Initial tests with MEMS revealed a vulnerability of some types of devices to radiation induced dielectric charging, a physical mechanism which also affects microelectronics, however integration of novel functional materials in microfabrication and the current trend to substitute SiO2 with high-k dielectrics in ICs pose new questions regarding reliability in radiation environments. The performance of MEMS devices with moving parts could also degrade due to radiation induced changes in the mechanical properties of the materials. It is thus necessary to investigate the effects of radiation on the properties of thin films used in microfabrication and here we report on tests with γ, high energy protons and fast neutrons radiation. Prototype SOI based MEMS magnetometers which were developed in UCL are also used as test vehicles to investigate radiation effects on the reliability of magnetically actuated and capacitively coupled MEMS. © (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Francis, L., Gkotsis, P., Kilchytska, V., Tang, X., Druart, S., Raskin, J.-P., & Flandre, D. (2013). Impact of radiations on the electromechanical properties of materials and on the piezoresistive and capacitive transduction mechanisms used in microsystems. Proceedings of SPIE 8614. Published. Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII (SPIE 2013), San Francisco (USA). https://doi.org/10.1117/12.2008531