Fabrication of new Interdigital Transducers for Surface Acoustic Wave Device

El Fissi, Lamia;Jaouad, A.;Vandormael, Denis;Francis, Laurent
(2015) 2015 International Congress on Ultrasonics (ICU 2015) — Location: Metz (France) (11.May.2015)

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Authors
  • El Fissi, LamiaUCLouvain
    Author
  • Jaouad, A.Department of Electrical and Computer, Engineering Faculty of Engineering Sherbrooke, Canada
    Author
  • Vandormael, DenisSIRRIS-Liege Science Park, Seraing/Belgium
    Author
  • Author
Abstract
We investigate high-performance interdigital transducers (IDTs) for the generation of surface acoustic waves (SAWs) on AT-cut quartz, where the metal fingers are embedded in the substrate. Three micromachining techniques are used to manufacture SAW structures, namely an inductively coupled plasma, a laser etching and a reactive ion etching. An evaporated layer of Al and a Ni thick electroplating are used to grow the metals in the micromachining structures. A chemical mechanical polishing (CMP) technique is used to remove the exceeding metal and keep a flat surface. The electrical characterizations indicate that the fabricated devices are suited for sensing proposes with a low insertion loss and a linear phase. Results are reported emphasizing the efficiency of the Ni damascene process to manufacture SAW sensors with the embedded structures.
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Citations

El Fissi, L., Jaouad, A., Vandormael, D., & Francis, L. (2015). Fabrication of new Interdigital Transducers for Surface Acoustic Wave Device. Physics Procedia, p. 936-940. https://doi.org/10.1016/j.phpro.2015.08.194