Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities
(2007) Journal of Telecommunications and Information Technology — Vol. 3, p. 61-66 (2007)
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Warsaw University of Technology Institute of Microelectronics and Optoelectronics
Citations
Gluszko, G., Lukasiak, L., Kilchytska, V., Chung, T. M., Olbrechts, B., Flandre, D., & Raskin, J.-P. (2007). Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities. Journal of Telecommunications and Information Technology, 3, 61-66. https://hdl.handle.net/2078.5/252446 (Original work published 2007)