Finger pad deformation under torsiondu Bois, Sophie;Cordova Bulens, David;Lefèvre, Philippe;Redmond, Stephen J;Delhaye, Benoit(2022) Eurohaptics Annual Meeting — Location: Hamburg, Germany
FilesNo attached file found for this publication.DetailsAuthorsdu Bois, SophieAuthorCordova Bulens, DavidAuthorLefèvre, PhilippeUCLouvainAuthorRedmond, Stephen JAuthorDelhaye, BenoitUCLouvainAuthorAffiliationsUCLouvainSST/ICTM/INMA - Pôle en ingénierie mathématiqueShow moreCitations APA Chicago FWB du Bois, S., Cordova Bulens, D., Lefèvre, P., Redmond, S. J., & Delhaye, B. (2022). Finger pad deformation under torsion. Eurohaptics Annual Meeting, Hamburg, Germany. https://hdl.handle.net/2078.5/239191