New developments of the residual stress actuated on-chip testing method
(2024) 2nd MecaNano General Meeting — Location: Vienna (1.May.2024)
Files
abstract_mecanano2024.pdf
Open Access - Adobe PDF
- 615.85 KB
Details
- Authors
Roisin, Nicolas 
- Abstract
- Over the last years, the on-chip tensile testing method has proven its potential for the characterization of the link between the mechanical behaviour and microsctructure at the micro- and nanoscale. While uniaxial tension is highly relevant to determine several mechanical properties, new on-chip loading configurations emerged recently to tackle challenges related to strain engineering studies as well as to the understanding of local deformation and relaxation mechanisms. An overview of the latest outputs obtained using the UCLouvain residual stress actuated on-chip method will be presented including the following progress: - An on-chip shear configuration has been designed in the context of addressing the optoelectronic properties of semiconductors. Monocrystalline Si thin films have been studied as a model system to optimize the design. - Long-term relaxation of thin films under tension providing information unavailable using conventional techniques like nanoindentation or direct tensile test.
- Affiliations
Citations
Colla, M.-S., Naceri, S. E., Roisin, N., Baral, P., Coulombier, M., Idrissi, H., Flandre, D., Raskin, J.-P., & Pardoen, T. (2024). New developments of the residual stress actuated on-chip testing method. 2nd MecaNano General Meeting, Vienna. https://hdl.handle.net/2078.5/238465