Lab-on-chip tensile stages for nanomechanical testing and TEM analysis
(2009) 35th International Conference on Micro & Nano Engineering - MNE′09 — Location: Ghent (28.September.2009)
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Boe, A., Coulombier, M., Colla, M.-S., Brugger, C., DILLE, J., Proost, J., GODET, S., Legros, M., Mompiou, F., Sharon, J. A., Hemker, K. J., Pardoen, T., & Raskin, J.-P. (2009). Lab-on-chip tensile stages for nanomechanical testing and TEM analysis. Proceedings of the 35 th International Conference on Micro & Nano Engineering, p. paper # O-MEMS-02. https://hdl.handle.net/2078.5/236841