Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface
(2006) 9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting — Location: Cancun, Mexico
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Olbrechts, B., Lejeune, B., Bertholet, Y., Pardoen, T., & Raskin, J.-P. (2006). Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface. Proceedings of the 9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting, p. Paper 1381. https://hdl.handle.net/2078.5/230700