Steady state measurement of wafer bonding fracture resistance
(2002) Eurosensors XVI, The 16th European Conference on Solid-State Transducers — Location: Prague (15.September.2002)
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Bertholet, Y., Iker, F., Raskin, J.-P., & Pardoen, T. (2002). Steady state measurement of wafer bonding fracture resistance. Proceedings of the 16th European Conference on Solid-State Transducers. Published. Eurosensors XVI, The 16th European Conference on Solid-State Transducers, Prague. https://hdl.handle.net/2078.5/230697