Steady-state measurement of fracture energy in wafer bonding

Bertholet, Yannick;Zhang, Xuan Xiong;Raskin, Jean-Pierre;Pardoen, Thomas
(2004) 27th Annual Meeting of The Adhesion Society - From Molecules and Mechanics to Optimization and Design of Adhesives Joints — Location: Wilmington, North Carolina, U.S.A. (15.February.2004)

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Bertholet, Y., Zhang, X. X., Raskin, J.-P., & Pardoen, T. (2004). Steady-state measurement of fracture energy in wafer bonding. Proceeedings of the 27th Annual Meeting of The Adhesion Society - From Molecules and Mechanics to Optimization and Design of Adhesives Joints, p. 438-440. https://hdl.handle.net/2078.5/230682