The fracture of polycrystalline silicon based MEMS

Wang, X.;Becker, G.;Ling, Wu;Pardoen, Thomas;Noels, L.;et.al.
(2012) 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2012 — Location: Lisbon, Portugal (16.April.2012)

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  • Wang, X.UCLouvain
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  • Becker, G.UCLouvain
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  • Ling, WuUCLouvain
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  • Pardoen, ThomasUCLouvain
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  • Raskin, Jean-PierreUCLouvain
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  • Noels, L.ULg, Liège, Belgium
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Wang, X., Becker, G., Ling, W., Pardoen, T., Raskin, J.-P., & Noels, L. (2012). The fracture of polycrystalline silicon based MEMS. Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2012. Published. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2012, Lisbon, Portugal. https://hdl.handle.net/2078.5/230576