Direct wafer bonding front propagation dynamicsNavarro, E.;Bréchet, Yves;Moreau , R.;Pardoen, Thomas;Radu, I.;et.al.(2013) WaferBond’13 — Location: Stockhom, Suède (4.December.2013)
FilesNo attached file found for this publication.DetailsAuthorsNavarro, E.SOITEC, Bernin, FranceAuthorBréchet, YvesSIMaP, Université de Grenoble Alpes, FranceAuthorMoreau , R.AuthorPardoen, ThomasUCLouvainAuthorRaskin, Jean-PierreUCLouvainAuthorRadu, I.SOITEC, Bernin, FranceAuthorShow more AffiliationsUCLouvainSST/IMMC/IMAP - Materials and process engineeringUCLouvainSST/ICTM/ELEN - Pôle en ingénierie électriqueShow moreCitations APA Chicago FWB Navarro, E., Bréchet, Y., Moreau, R., Pardoen, T., Raskin, J.-P., Barthelemy, A., & Radu, I. (2013). Direct wafer bonding front propagation dynamics. Book of abstracts. Published. WaferBond’13, Stockhom, Suède. https://hdl.handle.net/2078.5/227249