Bio-compatible Insulated Substrate Impedance Transducers

Pampin, Rémi;Moreno Hagelsieb, Luis;Flandre, Denis
(2009) 4th European Conference of the International Federation for Medical and Biological Engineering - ECIFMBE 2008 — Location: Antwerp, Belgium (23.November.2008)

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Authors
  • Pampin, RémiUCLouvain
    Author
  • Moreno Hagelsieb, LuisUCLouvain
    Collaborator
  • Author
Abstract
An alternative smart sensing paradigm to largescale biocompatible integration has been explored. Traditionally, conductive bio-labels detection profits from planar interdigitated electrodes (IDE) encapsulated between for instance a top thin alumina layer and a bottom thick silicon dioxide. Despite demonstrating good electrostatic sensitivity at strong micro-labels densities, such patterns however require sub-micron shrinking to work below 30% conductive labels coverage. We therefore derived a spectroscopic field-effect transducer from micrometric DDE coupled to a thinly insulated surface-doped silicon channel. Thanks to capacitance enhancement that results between electrodes and semiconductor, label-induced field-effect modulation of channel's conductance gives rise to an intrinsic dielectric relaxation constant change subsequently measured by impedance spectroscopy. So-called Insulated Substrate Impedance Transducers (ISIT) have thereby been designed to sense an inter-digital impedance spectrum change following a frequency-dependent multi-parameter approach. In demonstration, metallic grains densities ranging from 1.2% to 17%, ensued from 0 to 1 nM concentrations of silver-labeled 30 bp DNA targets were sensed in air on 100 * 100 mu m/sup 2/ arrays through conductance and capacitance variations by factors of 6 and 3, respectively. Our presentation will focus on simulation, optimization and characterization of ISIT's electrical operation, and present on-chip tuning possibilities associated with substrate back-contact biasing.
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Citations

Pampin, R., & Flandre, D. (2009). Bio-compatible Insulated Substrate Impedance Transducers. In Vander Sloten, J.; Nyssen, M.; Verdonck, P.; Haueisen, J.; (ed.), Proceedings of the 4th European Conference of the International Federation for Medical and Biological Engineering - ECIFMBE 2008 (pp. 1180-1183). Springer verlag. https://doi.org/10.1007/978-3-540-89208-3_282