On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams
(2011) Advanced Materials Research — Vol. 276, p. 117-126 (2011)
Files
No attached file found for this publication.
Details
- Authors
- Abstract
- A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mecanichal strenght of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strenght of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations.
- Affiliations
Citations
Bhaskar, U. K., Passi, V., Zulfiqar, A., Sodervall, U., Nilsson, B., Peterson, G., Hagberg, M., Pardoen, T., & Raskin, J.-P. (2011). On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams. Advanced Materials Research, 276, 117-126. https://doi.org/10.4028/www.scientific.net/AMR.276.117 (Original work published 2011)