On-chip fracture testing of freestanding nanoscale materials
(2015) Engineering Fracture Mechanics — Vol. 150, p. 222-238 (2015)
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- Abstract
- Recent enhancements of a versatile on-chip MEMS-based method dedicated to the deformation and fracture testing of freestanding nano-objects are described and applied to ~200 nm-thick silicon and copper films. The principle relies on the relaxation of internal stress present in actuator beams to deform test specimens owing to the etching of underneath sacrificial layer. Micro- and nano-fabrication methods produce thousands of elementary testing structures with various designs and loading configurations leading to statistically relevant fracture data. The data reduction scheme for analyzing the results of these tests has been recently upgraded and applied to silicon and copper films.
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Citations
Vayrette, R., Raskin, J.-P., & Pardoen, T. (2015). On-chip fracture testing of freestanding nanoscale materials. Engineering Fracture Mechanics, 150, 222-238. https://doi.org/10.1016/j.engfracmech.2015.07.006 (Original work published 2015)