SOI technology for future high-performance smart cards

Neve, Amaury;Quisquater, Jean-Jacques;Flandre, Denis
(2003) Workshop on Electronics in the 21st Century: Trends and Challenges — Location: Rome (Italy)

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Chips based on silicon-on-insulator technology meet the tough performance and security requirements presented by smart cards. A test chip manufactured in a fully depleted SOI process incorporates a charge pump and random-number generator, critical smart-card circuit blocks.
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Neve, A., Quisquater, J.-J., & Flandre, D. (2003). SOI technology for future high-performance smart cards. IEEE Micro, 23(3), 58-67. https://doi.org/10.1109/MM.2003.1209467 (Original work published 2003)