RF and linear performance of commercial 200 mm trap-rich HRSOI wafers for SoC applications

Roda Neve, Cesar;Ben Ali, Khaled;Malaquin, C.;Allibert, F.;Raskin, Jean-Pierre;et.al.
(2013) 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2013 — Location: Austin, Texas, USA (21.January.2013)

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Authors
  • Roda Neve, CesarUCLouvain
    Author
  • Ben Ali, KhaledUCLouvain
    Author
  • Malaquin, C.SOITEC, Bernin, France
    Author
  • Allibert, F.SOITEC, Bernin, France
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  • Author
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Abstract
We present for the first time the RF and linear performance of commercial 200 mm trap-rich HR-SOI wafers. These wafers are fully compatible with the thermal budget of CMOS process. The investigated SOI wafers with a fixed BOX of 400 nm-thick show effective resistivity values higher than 4 kΩ-cm and harmonic distortion levels lower than -81 dBm for a 900 MHz input signal with +15 dBm, i.e. more than 95 dBc. Our investigations confirm the capability of trap-rich HR-SOI wafer for the integration of RF systems in Si.
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Citations

Roda Neve, C., Ben Ali, K., Malaquin, C., Allibert, F., Desbonnets, E., Bertrand, I., Van Den Daele, W., & Raskin, J.-P. (2013). RF and linear performance of commercial 200 mm trap-rich HRSOI wafers for SoC applications. SiRF 2013 Techn. Digest, pp. 15-17. https://hdl.handle.net/2078.5/230153