Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding

Bertholet, Y.;Raskin, Jean-Pierre;Pardoen, Thomas
(2005) Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology and applications, 205rd Meeting of the Electrochemical Society — Location: Québec City, Canada (15.May.2005)

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Bertholet, Y., Raskin, J.-P., & Pardoen, T. (2005). Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding. Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology, p. 264-269. https://hdl.handle.net/2078.5/230691