The presentation conclude that thick SOI MEMS are on the market, possibility to build high quality integrated sensors and actuators based on CMOS materials, cointegration of bulk and surface micromachined MEMS with their associated SOI CMOS electronics, internal stress in thin films is of interest to and build-up 3D MEMS and develop nanomechanical testing lab-on-chip.
Raskin, J.-P. (2012). Sensing and MEMS devices in thin film SOI MOS technology. Proceedings of the 2nd Annual Congress of Nano-S&T – Nano S&T-2012, p. 64. https://hdl.handle.net/2078.5/230650