Effect of deposition parameters on the stress gradient of CVD and PECVD poly-SiGe for MEMS applicationsVan der Donck, T.;Proost, Joris;Baert, K.;Van Hoof, C.;Witvrouw, A.(2004) the SPIE Conference on Micromachining and Microfabrication Process Technology — Location: San Francisco - CA (2004)
FilesNo attached file found for this publication.DetailsAuthorsVan der Donck, T.AuthorProost, JorisUCLouvainAuthorBaert, K.AuthorVan Hoof, C.AuthorWitvrouw, A.AuthorAffiliationsUCLouvainFSA/MAPR - Département des sciences des matériaux et des procédésShow moreCitations APA Chicago FWB Van der Donck, T., Proost, J., Baert, K., Van Hoof, C., & Witvrouw, A. (2004). Effect of deposition parameters on the stress gradient of CVD and PECVD poly-SiGe for MEMS applications. Proceedings, p. 8-18. https://hdl.handle.net/2078.5/222002