A new scaling issue in the electrical behaviour of damascene vs. plasma-etched interconnects
(1998) Mater. Res. Soc. Conference on Advanced Metallization and Interconnect Systems for ULSI Applications — Location: San Diego - CA (1998)
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Proost, J., Conard, T., Boullart, W., Grillaert, J., & Maex, K. (1998). A new scaling issue in the electrical behaviour of damascene vs. plasma-etched interconnects. Proceedings, p. 535. https://hdl.handle.net/2078.5/221621