One-mask CMOS compatible process for the fabrication of three-dimensional self-assembled thin-film SOI microelectromechanical systems
(2005) Electrochemical and Solid-State Letters — Vol. 8, n° 10, p. H87-H89 (2005)
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- Abstract
- Multilayered self-assembled microstructures are built based on thin-film silicon-on-insulator (SOI) complementary metal-oxide-semiconductor (CMOS) compatible technology using a single mask process. The assembly relies on the chemical release of the microstructures and on the control of the residual stresses building up in multilayered structures undergoing a complete thermal process. The deflection of multilayered structures made of both elastic and plastic thin films results from the thermal expansion coefficient mismatches between the layers and from the plastic flow of a metallic layer. The process was successfully applied to 3-D self-assembled microstructures such as suspended meander inductors, thermal and flow sensors. (c) 2005 The Electrochemical Society.
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Iker, F., André, N., Pardoen, T., & Raskin, J.-P. (2005). One-mask CMOS compatible process for the fabrication of three-dimensional self-assembled thin-film SOI microelectromechanical systems. Electrochemical and Solid-State Letters, 8(10), H87-H89. https://doi.org/10.1149/1.2030488 (Original work published 2005)