Engineered substrates: The foundation to meet current and future RF requirements
(2015) VLSI TSA & VLSI-DAT — Location: Hsinchu (Taiwan) (27.April.2015)
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- Abstract
- The increasing demand for wireless data bandwidth and the rapid adoption of LTE and LTE Advanced standards push radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance [1]. In this paper, Soitec and UCL explain the value of using RF-SOI substrates and more especially the new generation of Soitec widely adopted eSI™ (enhanced Signal Integrity) substrate to achieve the RF IC performance requested to address the LTE Advanced smart phone market.
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Citations
Le Meil, J.-M., Aspar, B., Desbonnets, E., & Raskin, J.-P. (2015). Engineered substrates: The foundation to meet current and future RF requirements. Proceedings of the VLSI-TSA & VLSI-DAT, paper JS14, pp. 71-74. https://hdl.handle.net/2078.5/227827