Liquid and vapor phase silanes coating for the release of thin film MEMS
(2005) IEEE Transactions on Device and Materials Reliability — Vol. 5, n° 2, p. 250-254 (2005)
Files
No attached file found for this publication.
Details
- Authors
- Abstract
- Stiction remains one of the biggest reliability problems in the fabrication of microelectromechanical systems (MEMS). This work investigates the techniques adapted to release thin-film devices (100 nm thick) and submicron gaps MEMS. First, a CMOS compatible wet release process was developed, using nonchlorinated silanes coating providing a high hydrophobicity (contact angle in the range of 110 degrees). Second, a vapor phase release process based on the same chemistry is shown to be adequate to release thin-film beams from a silicon-on-insulator wafer, where the wet process failed. This is to the authors' knowledge the first time that an in-use stiction-free release process has been demonstrated for such thin structures. The layers resist up to 300 degrees C without damage and X-ray reflectivity confirmed that homogeneous monolayers; were obtained.
- Affiliations
Citations
Parvais, B., Pallandre, A., Jonas, A., & Raskin, J.-P. (2005). Liquid and vapor phase silanes coating for the release of thin film MEMS. IEEE Transactions on Device and Materials Reliability, 5(2), 250-254. https://doi.org/10.1109/TDMR.2005.846976 (Original work published 2005)