Lab-on-chip for testing thin film materials: extraction of mechanical and electrical properties under large deformation at the nanometer scale
(2016) Third Winfab Scientific Day — Location: UCL, Louvain-la-Neuve (Belgium) (29.January.2016)
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Coulombier, M., Raskin, J.-P., & Pardoen, T. (2016). Lab-on-chip for testing thin film materials: extraction of mechanical and electrical properties under large deformation at the nanometer scale. Third Winfab Scientific Day, UCL, Louvain-la-Neuve (Belgium). https://hdl.handle.net/2078.5/228081