Enhancement of the mechanical behavior of SLM AlSi10Mg by optimized thermomechanical postprocessing routes

van der Rest, Camille;Santos Macias, Juan Guillermo;Zhao, Lv;Marteleur, Matthieu;Simar, Aude;et.al.
(2021) THERMEC 2021 — Location: Vienne, Austria (Virtual Conference) (10.May.2021)

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Selective Laser Melting (SLM) processed AlSi10Mg is known for having high strength but low ductility behavior, with the interconnected Si network being the initiation point of damage. In this work, various thermomechanical post-processing treatments have been envisaged to tailor the microstructure and the mechanical properties of AlSi10Mg processed by SLM: heattreatments, hot isostatic pressing and friction stir processing. Both the static and fatigue properties were investigated and compared to the performances of the as-built material. Indepth microstructural and damage analyses complete the study. Optimized stress relieve heat-treatments (SRHT) allow to reach larger ductility thanks to a (partial) globularisation of the Si phase. Depending on the temperature and duration of the SRHT, a compromise is reached between high strength and large ductility. Hot isostatic pressing (HIP) combines the effect of SRHT with isostatic pressure. It is commonly used in the aerospace industry on cast parts in order to improve their fatigue life thanks to a reduction of porosity. However, up to now, there is no consensus in the literature on the efficiency of HIP on SLM AlSi10Mg. This work tried to highlight the advantages and disadvantages of HIP on such SLM microstructures and their resulting mechanical properties. Friction stir processing (FSP) of SLM AlSi10Mg brings locally globularised Si particles, homogenized microstructure and lower porosity levels. While the resulting tensile behavior is similar after FSP and after SRHT, the fatigue life is promisingly improved after FSP.
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van der Rest, C., Santos Macias, J. G., Zhao, L., Marteleur, M., Jacques, P., & Simar, A. (2021). Enhancement of the mechanical behavior of SLM AlSi10Mg by optimized thermomechanical postprocessing routes. THERMEC’2021 – Book of Abstracts, p. 701 (#1390). https://hdl.handle.net/2078.5/219660