Finite element simulations of parasitic capacitances related to multiple-gate field-effect transistors architectures

Moldovan, O.;Lederer, Dimitri;Iniguez, B.;Raskin, Jean-Pierre
(2008) IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - SiRF 2008 — Location: Orlando, Florida, USA (23.January.2008)

Files

No attached file found for this publication.

Details

Authors
  • Moldovan, O.Univ. Rovira i Virgili, Tarragona, Spain
    Author
  • Lederer, DimitriUCLouvain
    Author
  • Iniguez, B.Univ. Rovira i Virgili, Tarragona, Spain
    Author
  • Raskin, Jean-PierreUCLouvain
    Author
Abstract
In this paper, the impact of important geometrical parameters such as source and drain thickness, fin spacing, spacer width, etc. on the parasitic fringing capacitance component of multiple-gate field-effect transistors (MuGFET) is deeply analyzed using finite element simulations. Several architectures such as single gate, FinFETs (double gate), triple-gate represented by Pi-gate MOSFETs are simulated and compared in terms of channel and fringing capacitances for the same occupied die area. Simulations highlight the great impact of diminishing the spacing between fins for MuGFETs and the trade-off between the reduction of parasitic source and drain resistances and the increase of fringing capacitances when selective epitaxial growth (SEG) technology is introduced. The impact of these technological solutions on the transistor cut-off frequencies is also discussed.
Affiliations

Citations

  • APA
  • Chicago
  • FWB

Moldovan, O., Lederer, D., Iniguez, B., & Raskin, J.-P. (2008). Finite element simulations of parasitic capacitances related to multiple-gate field-effect transistors architectures. Proceedings of the IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - SiRF 2008, pp. 183-186. https://doi.org/10.1109/SMIC.2008.52