Extended low-temperature plasma-assisted bonding enhances wafer bonding strength uniformity

Zhang, Xiaodong;Raskin, Jean-Pierre
(2005) MRS Bulletin — Vol. 30, n° Issue 10, p. 688-689 (2005)

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Zhang, X., & Raskin, J.-P. (2005). Extended low-temperature plasma-assisted bonding enhances wafer bonding strength uniformity. MRS Bulletin, 30(Issue 10), 688-689. https://doi.org/10.1557/mrs2005.215 (Original work published 2005)