Parametric study of the plastic dissipation in the peeling of adhesively-bonded joints 9th
(2005) Conference on the Science and technology of Adhesion and Adhesives — Location: Oxford (UK)
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Martiny, P., Lani, F., Landis, C. M., Kinloch, A. J., & Pardoen, T. (2005). Parametric study of the plastic dissipation in the peeling of adhesively-bonded joints 9th. Conference on the Science and technology of Adhesion and Adhesives, p. 37-40. https://hdl.handle.net/2078.5/220801