Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)

Nassim, K.;Joannes, L.;Cornet, Alain;Dilhaire, S.;Claeys, W.;et.al.
(1998) 9th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 98) — Location: COPENHAGEN(Denmark) (1998)

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Authors
  • Nassim, K.
    Author
  • Joannes, L.
    Author
  • Cornet, AlainUCLouvain
    Author
  • Dilhaire, S.
    Author
  • Claeys, W.
    Author
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Abstract
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices. (C) 1998 Elsevier Science Ltd. All rights reserved.
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Nassim, K., Joannes, L., Cornet, A., Dilhaire, S., Schaub, E., & Claeys, W. (1998). Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI). 9th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 98), COPENHAGEN(Denmark). https://doi.org/10.1016/S0026-2714(98)00079-1