Advanced microelectromechanical systems-based nanomechanical testing: Beyond stress and strain measurements

Bhowmick, Sanjit;Espinosa, Horacio;Jungjohann, Katherine;Pardoen, Thomas;Pierron, Olivier
(2019) MRS Bulletin — Vol. 44, n° 06, p. 487-493 (2019)

Files

advanced_microelectromechanical_systemsbased_nanomechanical_testing_beyond_stress_and_strain_measurements.pdf
  • Open Access
  • Adobe PDF
  • 2.37 MB
MRSBulletin_2019_postprint.pdf
  • Open Access
  • Adobe PDF
  • 1.55 MB

Details

Authors
  • Bhowmick, SanjitBruker Nano Inc., USA
    Author
  • Espinosa, HoracioNorthwestern University, USA
    Author
  • Jungjohann, KatherineCenter for Integrated Nanotechnologies, USA
    Author
  • Author
  • Pierron, OlivierGeorgia Institute of Technology
    Author
Abstract
The fi eld of in situ nanomechanics is greatly benefi ting from microelectromechanical systems (MEMS) technology and integrated microscale testing machines that can measure a wide range of mechanical properties at nanometer scales, while characterizing the damage or microstructure evolution in electron microscopes. This article focuses on the latest advances in MEMS-based nanomechanical testing techniques that go beyond stress and strain measurements under typical monotonic loadings. Specifi cally, recent advances in MEMS testing machines now enable probing key mechanical properties of nanomaterials related to fracture, fatigue, and wear. Tensile properties can be measured without instabilities or at high strain rates, and signature parameters such as activation volume can be obtained. Opportunities for environmental in situ nanomechanics enabled by MEMS technology are also discussed.
Affiliations

Citations

Bhowmick, S., Espinosa, H., Jungjohann, K., Pardoen, T., & Pierron, O. (2019). Advanced microelectromechanical systems-based nanomechanical testing: Beyond stress and strain measurements. MRS Bulletin, 44(06), 487-493. https://doi.org/10.1557/mrs.2019.123 (Original work published 2019)