In this paper, we present a new de-embedding technique which does not require any dedicated RF test structure. This leads to great reduction of surface area on the wafer. Furthermore, this technique allows us to break through the re-contacting and dispersion problems that might affect the RF performance accuracy of future devices.
Pailloncy, G., & Raskin, J.-P. (2006). New de-embedding technique based on Cold-FET measurement. 1st European Microwave Integrated Circuits Conference (IEEE Cat.No.06EX1410), 4 pp. https://hdl.handle.net/2078.5/231111