Characterisation of copper films processed by evaporation
(2013) EUROMAT 2013 — Location: Seville, Spain (8.September.2013)
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- Surface functionalisation and processing of films and coatings are more and more important for advanced engineering applications. The present study reports the specific microstructure of copper films processed by evaporation. This process consists in the condensation of a metallic vapour that could be accelerated through a sonic ejector. Characterisation by scanning electron microscopy (SEM), electron-backscattering diffraction (EBSD) and X-ray diffraction (XRD) highlighted the relationship between the operating conditions (temperature, pressure, …) and the grain morphology and crystallography. Particularly, a large density of twins was found for specific evaporation temperatures. These twins are also related to the texture that forms from the first growth phenomena. The morphology of the films is also evolving through its thickness. Finally, nano-indentation revealed large levels of hardness for these films. Symp
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Citations
Marchal-Marchant, V., de Streel, M., Schmitz, A., Schmitz, B., Silberberg, E., Pace, S., Harlet, P., & Jacques, P. (2013). Characterisation of copper films processed by evaporation. Proceedings of EUROMAT 2013, p. 02955. https://hdl.handle.net/2078.5/202356