Rapid thermal annealing of electroplated Cu filmsBeyer, G.P.;Kitabjian, P.;Brongersma, S.H.;Proost, Joris;Maex, K.;et.al.(1999) Mater. Res. Soc. Conference on Advanced Metallization and Interconnect Systems for ULSI Applications (1999)
FilesNo attached file found for this publication.DetailsAuthorsBeyer, G.P.AuthorKitabjian, P.AuthorBrongersma, S.H.AuthorProost, JorisUCLouvainAuthorMaex, K.AuthorShow more AffiliationsUCLouvainShow moreCitations APA Chicago FWB Beyer, G. P., Kitabjian, P., Brongersma, S. H., Proost, J., Bender, H., Richard, E., Vervoort, I., Hey, P., Zhang, P., & Maex, K. (1999). Rapid thermal annealing of electroplated Cu films. Proceedings, p. 167. https://hdl.handle.net/2078.5/230847