A dynamic study for wafer-level bonding strength uniformity in low temperature wafer bonding

Zhang, Xuan Xiong;Raskin, Jean-Pierre
(2005) Electrochemical and Solid-State Letters — Vol. 8, n° 10, p. G268-G270 (October) (2005)

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Zhang, X. X., & Raskin, J.-P. (2005). A dynamic study for wafer-level bonding strength uniformity in low temperature wafer bonding. Electrochemical and Solid-State Letters, 8(10), G268-G270 (October). https://hdl.handle.net/2078.5/211371 (Original work published 2005)