Fabrication of new Interdigital Transducers for Surface Acoustic Wave Device

El Fissi, Lamia;Jaouad, Abdelatif;Vandormael, Denis;Francis, Laurent
(2015) 2015 International Congress on Ultrasonics (ICU 2015) — Location: Metz (France) (10.May.2015)

Files

Poster_ICU_2015.pdf
  • Restricted Access
  • Adobe PDF
  • 2.98 MB
Request a copy

Details

Authors
  • El Fissi, LamiaUCLouvain
    Author
  • Jaouad, AbdelatifCRN2 Lab, Department of Electrical and Computer Engineering, Faculty of Engineering Sherbrooke/Canada
    Author
  • Vandormael, DenisSIRRIS-Liège/Belgique
    Author
  • Francis, Laurentorcid-logoUCLouvain
    Author
Abstract
A major part of the research on Love mode surface acoustic wave (SAW) is focused on using different: - conventional piezoelectric substrates, guiding and sensing layers → to obtain low insertion loss, high power durability, high sensitivities In a classical fabrication scheme (a), the metal electrodes (IDTs) are deposited on top of the substrates In a proposed work metal fingers are embedded in the substrate (b) to improve the SAW device performance: - Micromachining structures: A laser, an inductively coupled plasma etching (ICP) and a reactive ion etching (RIE) - Metals growth: - Ni electroplating + chemical mechanical polishing (CMP) to remove the exceeding metal - Al evaporation + lift-off process
Affiliations

Citations

  • APA
  • Chicago
  • FWB

El Fissi, L., Jaouad, A., Vandormael, D., & Francis, L. (2015). Fabrication of new Interdigital Transducers for Surface Acoustic Wave Device. 2015 International Congress on Ultrasonics (ICU 2015), Metz (France). https://hdl.handle.net/2078.5/253332