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Combined_Thermo-Reflectance_and_Thin-Film_Coating_in_Near-Field_Imaging_of_Chip-Package-PCB-Antenna_Modules_for_Industrial-Testi.pdf
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Abstract
A holistic Near-Field (NF) Over-the-Air (OTA) testing solution for Chip-Package-PCB-Antenna modules based on combined thermo-reflectance and thin-film coating using Spin-Crossover (SCO) materials is proposed. The SCO coating process exhibits highly reliable thermometric performance (diffraction-limited sub-μm spatial, sub-μs temporal and 1°C thermal resolution), which stems to a large extent from the unprecedented quality of the vacuum-deposited thin films of the molecular complex used in this work. The resulting performance qualifies the SCO coating process, in terms of fabrication and switching endurance (surpassing 107 thermal cycles in ambient air), for industrial testing ensuring highly reproducible measurement results. The proposed NF sensing solutions are validated through several practical applications using front-end-modules (FEMs) manufactured in advanced GaN and FDSOI technologies co-designed with antenna-in-package (AiP) modules based on heterogeneous system-in-package (SiP) and WLCSP fan-in/fan-out integration assemblies.
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Al Khalifeh, K., Vanbrabant, M., Rack, M., Tihon, D., Craeye, C., Raskin, J.-P., Lederer, D., & et al. (2023). Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis. Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS). Published. Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS), Texas, USA. https://hdl.handle.net/2078.5/219056