Three-Dimensional Si-based Platforms for Energy Applications: Hierarchical Integration of Organic Materials.
(2014) Materials Research Society (MRS) Spring Meeting 2014 — Location: San Francisco (USA) (21.April.2014)
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- As a consequence of recent investigations that have used simple methods of lithography and material structuring, challenging the established Si nano-and micro-machining technologies, it has become apparent that hybrid organic-‐inorganic nanoarchitectonics can provide a unified strategy for the next generation of power sources [1]. Noticeably, electron-beam lithography merged with an ingenious resist composition and exposure modulation profile has enabled the direct writing of polymer three-dimensional (3D) lattices with periodicities and feature-sizes suitable for visible-spectrum photonic crystals. These superstructures can be easily co-integrated via transfer printing techniques with Si substrata accommodating classical photonic lattices obtained by novel deep-reactive ion etching protocols. Amongst the photonic crystals architectures, the 3D design remains the most challenging in fabrication and implementation. This originates from the stringent constitutional, quality and functional requirements. In this talk, a large area 3D structuring strategy for advanced photonic materials by adding the third dimension to two-dimensional (2D) colloidal etch masks is presented. Surface structuring by nanosphere lithography is merged with a novel silicon etching method to fabricate ordered 3D architectures. The SPRIE method, Sequential Passivation Reactive Ion Etching, is a one-step processing protocol relying on sequential passivation and reactive ion etching reactions using C4F8 and SF6 plasma chemistries. Careful adjustments of both mask design and lateral etch extent balance allow the implementation of even more complex functionalities including photonic crystal slabs and precise defect engineering. The 3D photonic crystal lattices exhibit optical stop-bands in the infrared spectral region proving the potential of SPRIE for fast, simple and large-scale fabrication of photonic structures. Structural characterization and numerical modeling corroborate the optical response of the obtained photonic structures. The SPRIE protocol is presently investigated for the realization of tapered structures with axial diameter modulation designed to enhance the light absorption in Si solar cells or in Schottky junction solar cells with conducting polymers. Several classes of novel materials can be used in conjunction with these 3D Si platforms to design organic–group IV semiconductor hybrid solar cells [2].
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Melinte, S. (2014). Three-Dimensional Si-based Platforms for Energy Applications: Hierarchical Integration of Organic Materials. Proceedings of the MRS Spring Meeting, 1. https://hdl.handle.net/2078.5/218882